Akrometrix加熱翹曲測量儀接口分析Interface Analysis


Akrometrix iawpwf_croppedsoftware：理解加熱翹曲在兩個配合表面之間
cores加熱、測量、分析、報告全程實現自動化,不需前處理；3D快速掃描,連續快速測量整個平面,并能獲取準確的數據，3D技術記錄全過程的平面翹曲變化,系統自動實時測試分析翹曲數據,并形成影像,可以產生數據完備的動態報告、靜態報告.

Akrometrix加熱翹曲測量儀接口分析Interface Analysis
表面貼裝元件在回流焊過程中翹曲，以及它們所連接的區域在裝配過程中也改變形狀。此組件之間的接口是焊料，粘貼和間隙創建由于熱膨脹結合起來，創造**個良好的產品，或缺陷，如頭在枕頭，短褲，并打開。充分認識到，表面之間的關鍵接口比以往任何時候都更重要。
而標準Akrometrix軟件允許一個人表面的分析，如PCB、BGA、接口分析是新的軟件，使3D，2D，和一個完整的接口統計評論。用戶現在可以可視化和量化到底是如何兩個表面將隊友在一起。通過結合此功能與在回流焊過程中的每個溫度點上的測量表面的能力，焊點的形成或故障可以預測更容易。
提供的任何250 + thermoiré系統使用遍布**電子供應鏈的今天，數據接口分析。引入*特的功能，如通/警告/故障圖，和各種間隙和表面計信息，接口分析，讓用戶看到什么是發生在兩個動態表面之間通過回流過程。

Akrometrix加熱翹曲測量儀接口分析Interface Analysis應用包括SMT裝配規劃和故障診斷、失效分析、供應商的資質和比較，進行SPC，包裝設計和有限元分析模型的驗證兩個重要應用領域
包裝設計和裝配的軟件包
許多技術論文描述翹曲為流行設計的關鍵
更薄的設備導致更薄的流行層
**部和底部翹曲的附加表面是關鍵
在所有溫度下的界面分析允許“容易”的形狀比較
用戶可以在地圖上設置限制時和“看”的問題
更多的層（如破皮）使翹曲更重要
封裝到電路板的設計和裝配
從IPC技術論文頭枕缺陷：
“對一個供應商問題的主要貢獻者是BGA組件的完整性。主要部件的完整性問題，有助于頭枕的缺陷是產品制造業回流過程中構件的翹曲。如果組件在焊接過程中開始翹曲，組件球將從焊料膏和不濕的散裝焊料分開。元件封裝設計、材料和完整性都有助于部分潛在的翹曲。內部驗證試驗應了解潛在的組件的翹曲到新方案實施到制造過程之前。”
接口分析與兩個陰影莫爾é和DFP的數據集，可以混合和匹配的數據從兩種技術。



相關產品
CORES 平面度測量/平整度測試/加熱翹曲測量 
core9012a/core9031a/core9032a/core9037a/core9038a/core9045a/core9046a/core9050b/core9055a/core9060a/core9070a/core9100a
Akrometrix平面度測量/平整度測試/加熱翹曲測量
AXP-300x233/Convective-Module-Tower/CRE6 Module/CXP/DFP Module/DIC 2.0 Module/Digital Fringe Projection/Digital Image Correlation/Akrometrix Interface Analysis/Akrometrix Part Tracking/PS200S/PS600S/Real Time Analysis/Akrometrix Shadow Moiré/Akrometrix Studio Platform




Interface Analysis
IAwPWF_CroppedSoftware: Understanding Warpage Between Two Mating Surfaces

Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create ** good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.

While standard Akrometrix software allowed the analysis of an individual surface, such as a PCB or BGA, Interface Analysis is new software that enables 3D, 2D, and statistical review of a complete interface. Users can now visualize and quantify exactly how two surfaces will mate together. By combining this feature with the ability to measure surfaces at each temperature point during reflow, solder joint formation or failure can be predicted much more easily.

Interface Analysis works with data supplied by any of the 250+ TherMoiré systems in use throughout the worldwide Electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, and various gap and surface gauge information, Interface Analysis lets users see what is happening between two dynamic surfaces through the reflow process. Applications include SMT Assembly Planning and Troubleshooting, Failure Analysis, Supplier Qualification and Comparison, Ongoing SPC, Package Design, and FEA Modeling Validation

 

Two Important Application Areas

Package-on-Package Design and Assembly

Many Technical Papers describe warpage as critical to PoP design
Thinner Devices lead to thinner PoP layers
Warpage of Top and Bottom ‘Attach’ Surfaces is Critical
Interface Analysis allows ‘easy’ shape comparison at all temperatures
User can set Limits and ‘see’ problem areas in PWF Maps
More Layers (such as with PoPi) make warpage more important
Package-to-PCB Design and Assembly

From Head-in-Pillow defect IPC technical paper:
“One of the major contributors to the supplier issues is the integrity of the BGA component. The main component integrity issue that contributes to head-in-pillow defects is component warpage during the product manufacturi

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